Europe UK : TTPCom Ltd has signed a contract for its cellular baseband chipset design, CBEmacro 3G. CBEmacro exploits TTPCom's intelligent architecture to deliver a proven and robust communications sub-system, enabling innovative and price competitive chipsets with a shorter time-to-market. Semiconductor vendors adopting CBEmacro can expect to sample silicon within nine months of project start. The customer details remain confidential at this stage.

TTPCom's CBEmacro 3G is a complete and ready for silicon multi-mode GSM/EDGE/W-CDMA cellular baseband modem design. CBEmacro includes processors,peripherals, communications hardware, protocol software and external interfaces, delivered and warranted as a 'black box' silicon IP core.

"Semiconductor manufacturers incorporating the CBEmacro 3G design into their products can reduce overall system cost and time to market by allowing their engineering efforts to focus on product applications and peripheral mix rather than the complexities of developing and maintaining the modem and protocol stack", says "Julian Hildersley, Managing Director of TTPCom's Silicon Business Unit. "This will allow customers to develop world class chipset solutions that will be highly competitive in die size, power consumption and applications capability."

This announcement represents a major milestone in TTPCom's development of the next generation of 3G Intellectual Property platforms. TTPCom will release an HSDPA upgrade for CBEmacro 3G early in 2006, incorporating a high performance advanced digital receiver design capable of operation at the full Category 10 rates (14Mbits/sec). Further additions to the CBEmacro family of semiconductor designs are also under development.