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Micro Power Amplifier for 3G Phones

11th June 2003

To meet industry requirements for small, lower-power circuits for cell phones, Toshiba announced that the company has extended its line-up of RF gallium arsenide (GaAs) hetero-junction bipolar transistor (HBT) modules to include a micro power amplifier for 3G W-CDMA cellular handsets. The new device, designated S-AL57, features very low power consumption, high output power and additional functions optimized for cellular handsets.

Toshiba will show the micro power amplifier module, along with other new microwave and RF devices, at this year's IEEE MTT-S International Microwave Symposium, held June 10 through 12 in Philadelphia, Pennsylvania.

Toshiba's micro power amplifier is targeted for use in 3G phones using the W-CDMA protocol, a technology for wideband digital audio communications of Internet, multimedia and other capacity demanding applications. W-CDMA has been selected for the third generation of mobiles telephone systems in Europe, Japan and the United States.

"Toshiba is committed to maintaining its position as a leading global provider of advanced RF solutions," said Hideki Ohto, senior manager of application engineering for Small Signal Discrete Semiconductor Devices, Toshiba Corporation. "This micro power amplifier for W-CDMA cell phones is an example of our continued innovation to meet industry demands for improved performance while reducing component size and power consumption."

The S-AL57 achieves high output power (Po) of 27.0 decibels (dBm) and gain of 27.5dB with high power added efficiency of 46%. This new power amplifier incorporates additional functions optimized for cellular handsets, including low idle current of only 40mA, a bias circuit with temperature compensation and lower power sensitivity control functions. It operates from a single 3.5V power supply.

As a GaAs HBT power amplifier module with a bias circuit, the S-AL57 provides excellent linearity, enabling design engineers to achieve high output power. The small 8-pin package (4.0 x 4.0 x 1.2 millimeters) enables engineers to create smaller handset designs. The power amplifier module includes the required RF matching circuits within the package to simplify system design.

Technical Specifications Toshiba S-AL57 Micro Power Amp for W-CDMA

Part Number S-AL57

Output Power (Po) 27.0dBm

Power Gain (Gp) 27.5 dB @Vcc=3.5V, Po= 27.0dBm,
f=1.95GHz

Power Added Efficiency 46% @Vcc=3.5V, Po=27.0dBm, f=1.95GHz

Idle Current 40mA

Process GaAs HBT

Packaging 8-pin

Dimensions 4.0mm x 4.0mm x 4.0mm

Pricing and Availability

Samples of Toshiba's S-AL57 GaAs power amplifier will be available in July 2003, priced at $15.00 each. Volume production is scheduled to begin in first quarter 2004.

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