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| Industry's
First Single-Chip UMTS and HSDPA Solutions |
See
below for the rest of today's 3G news from 3G.co.uk |
| 13th
November , 2006 |
|
The new QSC6240 product for WEDGE (WCDMA and GSM/GPRS/EDGE) and QSC6270 product for HEDGE (HSDPA/WCDMA and GSM/GPRS/EDGE) are the world's first solutions to integrate a monolithic die -- with integrated radio transceiver, baseband modem and multimedia processor -- together with power management functionality into a single chip for WCDMA (UMTS) and HSDPA handsets. The cost and time-to-market advantages of the single-chip solutions will help drive wireless broadband and 3G adoption in mass markets around the world. "By introducing our fourth generation of single-chip solutions that include WCDMA/EDGE and HSDPA/EDGE, QUALCOMM is making the high-speed data and rich multimedia capabilities of 3G technologies accessible to a much wider base of wireless users around the world," said Dr. Sanjay K. Jha, president of QUALCOMM CDMA Technologies. "QUALCOMM is leveraging its technology leadership in 3G and single-chip design to significantly drive down the cost of 3G handsets and considerably reduce time to market by offering the world's first single-chip WCDMA and HSDPA solutions." The high levels of integration in the QSC6240 and QSC6270 solutions significantly reduce bill-of-materials costs and discrete components, delivering board-area savings of up to 50 percent. The two solutions leverage cost-efficient 65nm CMOS process technology and significantly improve power efficiency for longer talk/standby times and an enhanced multimedia user experience. The two solutions feature: * Complete chipset
solution in a 12mm x 12mm package |
| Rest of Todays 3G News |