TTP Communications plc, the world's leading independent supplier of technology for digital wireless communications, today announces that IBM has licensed its dual system 3G/GSM technology for radio chipsets. TTPCom's technology will enable IBM to make low power radio chipsets for use in next generation wireless devices.

'The combination of TTPCom's IP and IBM's leadership in silicon germanium (SiGe)
technology will enable us to broaden our circuit portfolio and meet 3G demands,'
said Ken Torino, director, wireless products, IBM Microelectronics. IBM was the
first company to broadly manufacture silicon germanium products.

TTPCom's dual system 3G/GSM RFIC architecture enables companies like IBM to make
radio chipsets for use in devices which are compatible with 2G, 2.5G and 3G
wireless telecoms networks.

'We're very pleased to be working with IBM on 3G/GSM dual system radio frequency
integrated chipsets ('RFIC') development', said Gordon Aspin, Operations
Director, TTPCom. 'This is our second licence agreement for 3G radio chipsets,
which demonstrates that the market sees the value in TTPCom's IP based approach
to RFICs. This IP gives our clients instant access to our extensive RF design
expertise and enables them to benefit from our familiarity with GSM and 3G
standards. He concluded 'combining TTPCom's RFIC experience and understanding
of the standards with IBM's circuit design skills and state of the art process
technology will enable very high performance RFICs to be developed for the
upcoming dual system terminal market.'