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Royal Philips Electronics and Ericsson Mobile Platforms signed an agreement which reinforces their strategic partnership in the development of leading 2.5 and 3G mobile handset technologies, using Philips' advanced semiconductor capabilities.

Under the terms of the agreement Philips will source semiconductor devices for Ericsson reference designs. Philips will make its latest semiconductor technologies available for Ericsson reference designs. The co-operation will give Ericsson access to Philips' vast semiconductor product and technology portfolio including RF ASICs, baseband ASICs, Power Amplifiers (PA) and Power Management Units (PMU).

The co-operation between the two companies will drive the development of next generation mobile handsets, enabling multimedia and image transition applications for end-users. The partnership strengthens Ericsson's leading position in the mobile handset market and Philips' leading position in semiconductor wireless applications.

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"We have had an established relationship with Philips for many years and this is a natural choice for us," said Tord Wingren, president of Ericsson Mobile Platforms. "The company's leading position in the communications market, combined with its low-cost, high-performance RF process technology, will enable Ericsson Mobile Platforms to realize its goal to support all major next-generation wireless standards including GSM/GPRS, EDGE and WCDMA.

Increasing our co-operation will help us focus on a limited number of key partners."
"The extension of our partnership with Ericsson Mobile Platforms will provide handset and original equipment manufacturers with instant access to cutting-edge technology," says Mario Rivas, executive vice president communications businesses Philips Semiconductors. "In addition to our RF expertise we are able to offer Ericsson the latest baseband and wireless technologies, and as the partnership develops, access to the complete range of Philips' semiconductor expertise needed to build state-of-the-art 2.5 and 3G handsets."